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ADT 7900划片机系列

名称: ADT 7900划片机系列
说明:  

以色列制造


Strong in dicing
Advanced Dicing Technologies (ADT) is specialized in the development and manufacturing of systems, blades and processes used in the dicing of silicon-based ICs, Package Singulation and hard material Microelectronic Components (MEC).


The 7900 Series

ADT offers 2 models of dicing system:

 

1. 7910 Uno -

As part of the growing market and the ongoing demand to lower the cost of production per unit (CoO), ADT has responded with a single spindle system model 7910 Uno.

The 7910 Uno system provides a perfect solution for standard silicon wafers up to 8” and for low cost discrete devices.

Further to the automatic vision and easy Graphic User Interface (GUI), ADT is offering a machine at small foot print for saving cost on the production floor.

 

7910 Series Advantages:

  Up to 8” wafer
  Fast automatic alignment and cut positioning increase throughput
  Automatic Kerf inspection increase yield
  Automatic Y offset correction ensures maximum precision
  Single low vibration spindle enable superb cut quality
  Friendly and intuitive GUI
  Touch screen user interface
  Easy to load and unload
  Easy to maintain
  Small footprint reduces cost of ownership
  Price
 

2. 7900 Duo -

As part of the growing market of the LED segment and the on going demand to lower the cost of production per unit (CoO), ADT has responded with a dual spindle system model 7900 Duo that double the productivity while maintaining the same current production floor space.

The 7900 Duo system provides a perfect solution for applications that require a long cut cycle time such as image sensors and saw devices.

Further to the automatic vision and easy Graphic User Interface (GUI), ADT is offering a unique feature for processing and programming of broken wafers.

 

7900 Series Advantages:

Two facing spindles enable simultaneous dicing
Low vibration platform
Fast automatic alignment and cut positioning increase throughput
Small footprint reduces cost of ownership
Automatic Kerf inspection increase yield
Automatic Y offset correction ensures maximum precision
Tape surface detection ensures consistent cut quality
Touch screen user interface