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GDT Series is designed to fix wafer during dicing process of semiconductor, optical and electrical devices manufacturing. A optimal dicing tape high technology expected should be capable of high quality and developments for varied chips to meet the requirements of each type of wafer; GDT Series has been used and proved its capability and quality by lead manufactories. The excellent adhesiveness of GDT Series dicing UV tapes is able to hold wafer during dicing, but could be easily peel off after UV exposure.
● High performance adhesive
● Excellent control on back-side chipping and chip fly-off
● Could be easily peeling off by debonding with UV exposure
● Perform high efficiency on EMC(Epoxy Mold Compound) and other types of difficult-to-adhere products
Construction
GDT Series UV Tape is composed of three layers: Polyolefin Base Film, UV Sensitive Adhesive and Release Film.
Dimension
Standard widths: 160mm, 180mm, 230mm, 300mm, 330mm and 400mm.
Standard Lengths: 100m on a 3”I.D. plastic core. (splice-free)
Both widths and lengths are available for customization.
Shelf Life and Storage
Storage Condition Requirement: 25°C +/- 10° and 60% RH +/- 20%.
Shelf life: 6 months from the date of manufacture if stored as recommended.
As GDT Series UV tape features UV-sensitive, please keep away from heat and direct sunlight.
Properties GDT 
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