名称：Bondjet BJ820
说明： Description High Speed Fully Automatic Fine Wire Wedge Bonder The Thin Wire Wedge Wedge Bonder Bondjet BJ820 is the latest development of Hesse's wedge bonding innovation, responding to all wire bonding challenges on a single platform for a variety of applications such as RF and microwave devices, COB, MCM and hybrids, fibre-optics and automotive using aluminium wire, gold wire or ribbon. The BJ820 defines the benchmark in the industry for example by offering:The fastest wiring speed of a wedge bonderThe largest work areaThe greatest axis accuracyPrecision1 μm at 3 σ axis repeatabilityHigh precision touchdown detection without time delayPrecise control of bond force (1 cN)FlexibilityLargest bonding area: 305 mm x 410 mm (12" x 16.1")Can serve with two or more smaller bonding stations for efficient handling of smaller products or substrates, elimination indexing time and maximizing throughput (with indexers as well as manual loading)Enables intelligent automation of extra large productsSpeedUp to 7 wires per secondQualityRealtime bond quality monitoring systemWear free and almost maintenance free piezo bondhead with solid state hingesThe PBS200 software supports control by host computer, product traceability and external statistical analysisProcess integrated Quality Control (PiQC) for advanced quality monitoringE-Box: patented solution for optimized tool changeSmall Footprint, Big CapabilityIntegrates easily into complex production linesProcess AdvantagesLoop length: 70 µm up to 20 mmVarious loop form functionsConstant wire lengthConstant loop heightIndividual loop shapesFine Pitch capability < 40 µm Technical DataWorking area305 mm x 410 mm (12" x 16.1")Z-axis stroke: 30 mm (1.2")Mechatronic bondhead45° StandardDeep Access optional60° optionalWireAl, Au: 17.5 μm - 60 μm (0.7 mil - 2.4 mil)Optional: 12.5 μm - 75 μm (0.5 mil - 2.9 mil)RibbonAl, Au: 6 μm x 35 μm (0.25 mil x 1.4 mil) up to 25 μm x 250 μm (1 mil x 10 mil) with the deep access bondheadEasy change-over from wire to ribbonPositioning repeatabilityAxis repeatability 1 μm (0.04 mil) at 3 σMachine dimensions2035 mm x 722 mm x 1250 mm (H x W x D)80.1" x 28.4" x 49.2" (H x W x D)Height of work areaHeight of bonding area over floor 960 mm according to SMEMA(37.8")Height over machine base plate 168 mm ± 1 mm (6.6")Power supply2,2 kW230 V, 50-60 Hz, +8%, -10% Compressed air5 bar clean and dry (CDA)Dew point -35°CFiltered < 10 µmWeight1350 kg Bondhead 45°/60°45 ° / 60° Standard-Piezo-BondheadTransducer suspension without tilt motion guarantees true vertical wedge tool at any timeWear free and low maintenance components with PIEZO-TechnologyFree programmable tail length, tear stroke and opening gap of wire clampWire clamp easy adjustable in all directionsContactless „touchdown" sensor with virtually no signal delayPrecise force control with an accuracy of 1 cN (static and dynamic)Touchdown force programmable; reliable down to <3 cN for applications with smallest wire diameters or minimal bondfoot geometriesCompact design reduces weight and moment of inertia allowing higher accelerationsHigh mechanical stiffness of suspension helps eliminate undesired vibrationsBondhead Deep AccessOptional: Deep Access BondheadDeep access version for bonding ribbon and packages with access limitationsTransducer suspension without tilt motion guarantees true vertical wedge tool at any timeWear free and low maintenance components with PIEZO-TechnologyFree programmable tail length, tear stroke and opening gap of wire clampAdditional clamp above the transducer for optimized clamping force controlContactless „touchdown" sensor with virtually no signal delayPrecise force control with an accuracy of 1 cN (static and dynamic)Touchdown force programmable; reliable down to <3 cN for applications with smallest wire diameters or minimal bondfoot geometriesCompact design reduces weight and moment of inertia allowing higher accelerationsHigh mechanical stiffness of suspension helps eliminate undesired vibrations14 mm diving depth for bonding inside packages with 1" wedge tool; optional 18 mm with 1,3" wedge tool